Cooling of electronic equipment

2020/06/04 (Day 2), Room E

• 14:00 〜 15:20

  E23 Cooling of electronic equipment 1

  chair

  E231

  Thermal resistance model by VHDL-AMS description corresponding to flow rate
  ◯ Noboru Takizawa (Rohm Co., Ltd.)

  E232

  Investigation Regarding Thermal Resistance of Surface Mount Type Power Semiconductor Package
  ◯ Koji NISHI, Takahiro MIKUNI (Ashikaga Univ.)

  E233

  Development of thermal design for desired temperature distribution based on combination with reduction order model and artificial bee colony algorithm
  ◯ Wataru SATO (Hitachi, Ltd.), Nobuyuki ISOSHIMA, Tatsuya KOBARI, Taro NAKAZAWA, Jin MATSUMURA, Motohiro YAMAZAKI (Hitachi High-Technologies Corporation)

  E234

  Study of machine learning thermal network model for thermal design of electronic devices
  ◯ Daiki OTAKI, Hirohumi NONAKA, Noboru YAMADA (Nagaoka University of Technology)

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2020/06/05 (Day 3), Room E

• 09:30 〜 10:50

  E31 Cooling of electronic equipment 2

  chair

  E311

  Simulation for Modeling of Thermal Contact Resistance under High Heat Flux
  ◯ Risako Kibushi (Sanyo-Onoda City Univ.), Tomoyuki Hatakeyama (Toyama Prefectural Univ.), Kazuhisa Yuki, Noriyuki Unno (Sanyo-Onoda City Univ.), Toshio Tomimura (Kumamoto Univ.), Masaru Ishizuka (Toyama Prefectural Univ.)

  E312

  Evaluation of contact thermal resistance of BMR2 in low contact pressure regions
  ◯ Yuki Ichimaru, Tomoyuki Hatakeyama, Yoshiki Hyodo (Toyama Prefectural University), Risako Kibushi (Sanyo-Onoda City University), Masaru Ishizuka (Toyama Prefectural University)

  E313

  Optimization of mixed refrigerant components for liquid cooling using Digital Annealer
  ◯ Takeshi SHIOGA, Hideyuki JIPPO, Mari OHFUCHI (Fujitsu Lab.)

  E314

  Critical heat flux improvement of two-phase immersion cooling by controlling breathing phenomenon
  ◯ Daiki NEGITA, Kazuhisa YUKI, Noriyuki UNNO, Risako KIBUSI (Univ.Sanyo-Onoda City), Takuya IDE (Lotus Thermal Solution Inc.　), Tetsuro OGUSHI, Masaaki MURAKAMI, Tomiyuki NUMATA (Lotus Thermal Solution Inc.), Hikaru NOMURA (Univ.Osaka)

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2020/06/05 (Day 3), Room E

• 11:05 〜 12:25

  E32 Cooling of electronic equipment 3

  chair

  E321

  Proposal and evaluation of ultra-thin multi-evaporator loop heat pipe
  ◯ Kenya Sugimoto (Univ. Nagoya), Yoshihiro Machida (SHINKO ELECTRIC INDUSTRIES CO., LTD.), Housei Nagano (Univ. Nagoya)

  E322

  Heat transfer evaluation inside the high voltage switches heated by arc discharge
  ◯ Koutaro Tsubaki (Saga Univ.), Akio Saitsu (Togami Electric Mgf. Co., Ltd.), Yuichi Mitsutake (Saga Univ.)

  E323

  Relationship between heat loss and measurement accuracy in thermal contact resistance measurement with steady state method
  ◯ Yusuke NAKAMURA, Tomoyuki HATAKEYAMA, Yoshiki HYODO, Yuki ICHIMARU (Toyama Prefectural University), Risako KIBUSHI (Snyo-Onoda City University), Masaru ISHIZUKA (Toyama Prefectural University)

  E324

  Effect of thermal vias and inner layer solid patterns on in-plane thermal conductivity of printed circuit board
  ◯ Yuki TAGUCHI, Tomoyuki HATAKEYAMA, Yoshiki HYODO, Yuki ICHIMARU (Univ. Toyama Prefectural), Risako KIBUSHI (Univ. Sanyo-Onoda City), Masaru ISHIZUKA (Univ. Toyama Prefectural)

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2020/06/05 (Day 3), Room E

• 13:40 〜 14:40

  E33 Cooling of electronic equipment 4

  chair

  E331

  CFD-Based Study on Relationship between Heat Transfer Enhancement by Pulsating Flow and Height of Rectangular Rib
  ◯ Shintaro HAYAKAWA, Takashi FUKUE (Kanazawa Inst. Tech.), Hidemi SHIRAKAWA (NIT, Toyama College)

  E332

  Initial cooling technology using gas helium for multiple channels with large heat capacity differences
  ◯ Naoki Iwamoto, Masayoshi Oya (Mitsubishi Electric), Suguru takada, Shinji Hamaguchi, Imagawa Shinsaku (National Institute for Fusion Science)

  E333

  Preparation of fluorescent microcapsule containing temperature-sensitive magnetic material and visualization of two-dimensional flow field
  ◯ Keiko ISHII, Ryota AIZAWA, Kazuki OGURA, Koji FUMOTO (AGU)

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